Can somebody give answer for given questions: How to use cooling as input to the flow analysis? Why filling should not be used as a input to the cool analysis?

1) you have to add the waterline information as CAD data and mesh it into the model...using the analysis option of Cooling + Filling + Packing + Warpage to have the complete package.
2) Filling is an output of the Fill analysis, therefore it can't be used as an input to any other analysis...

i don't fully understood the nature of your questions, but i hope i gave you a clearer idea on how to use the software.

regards,
hugoh

Hi

If I understand what you are asking, with cooling you are just testing the heat removal effectivness of the proposed cooling system within the tool. Cooling should highlight any areas with poor heat removal this can be modified/corrected, the filling time is not used because the part weight dictates how much heat energy removal (Heat Conent in Joules/per gram) is required.

Hope this helps

Br

Paul

I think I understand your question.

Firstly, to use cooling analysis results as an input to Fill+Pack you must select the correct order of analyses. i.e. Cool+Fill+Pack. Obviously you need to model the cooling channels with beam elements.
Alternatively, you can also use the following sequence, Fill+Pack+Cool+Fill+Pack. But this is time consuming and perhaps offers little advantage compared to the resources needed.

The reason we use cooling analysis results as in input to the Fill+Pack is that we get a more realistic mold temperature distribution and thus the polymer flow can take the actual temps into account rather and using a constant mold temp. This lead to futher advantages in freeze time and part temperature calculations

Hope i answered your question

Nishit

Your questions is not clear to me.Can you explain it clearly.

Cool analysis is done with basis of same resin temperature. With Fill-Cool, Fill passes resin temperature at the time of cavity filled to Cool. The sequence was general at the dynamic series era(before 2000), but now the difference is recognized as ignorable.

The analysis you run, is going to utilize some sort of cooling numbers. If you do not define the size and locations of your cooling lines, Moldflow ASSUMES a perfect tool and cooling enviroment, ie.. your tool is built Perfectly. However in the real world, we know we know this is not true. Don't run cooling unless you have the mold drawing sitting in front of you, you will only make life more difficult. If you don't have the mold drawing and need to do a cooling analysis, use the MF wizard, and accept the defults
it will get you closer, the best thing to do is, have the mold drawing, mold material, known inserts material, and most of all, ask the question "why do you think you need a cooling analysis" also review your results carefully even as another moldflow user for inputs. Hope this helps,

Hello Murugan,
I agree with what other users have answered you already. Here are my two cents:
1)How to use cooling as input to the flow analysis?
By using the analysis sequence Cool+ Fill+Pack will be the only way Cooling output will be the input or the Flow analysis. I will agree with Craig, you do need to know what are you expecting to answer from the analysis before this is done. If you are to run such analysis enter as much information you have available to leave the least amount of assumptions pending.
2) Why filling should not be used as a input to the cool analysis?
As a software program you need to make an assumption to run an analysis. In most cases, it is recommended to run first Cooling than Filling as the start of the sequence. The debate stands that Cooling assumes that the part is at melt temperature while Filling assumes the mold is uniform at the set mold temperature. Many case studies indicate that the Cooling analysis assumption is the best and will lead to more accurate results, in the event you do not have the time to run the complete multiple analysis Fill+Pack+Cool+Fill+Pack.

When you are running cooling analysis, with the resin selected, there is already a material data. What is missing is the shear heating in the mold. As per Moldflow guidelines, during filling you may not allow shear heating to exceed beyond limits. Thus, the temperature range is known. Anyway before going for cooling analysis one optimizes the filling and packing as cooling can take long time based on the circuit design.